Rotary Ceramic Sputtering Target

Rotary Ceramic Sputtering Target

Excellent properties such as high purity, high density,Good microstructure uniformity, excellent electrical properties.

High purity: The metal target requires very high purity, to ensure the stability and reliability of the material.We have various purity levels to suit your specific requirements, with the minimum purity of 99.5% up to 99.9999% for some metals. Also have controlled specific impurities within the target.

High density: Metal targets have high density characteristics, usually up to 95-99.5%,（ITO,NbOx can reach 99.5%) to ensure the stability and quality of materials.

High thermal conductivity: the thermal conductivity of the metal target is particularly high, which can be cooled quickly and improve the coating speed.

Microstructure uniformity: powder metallurgy process to ensure the overall uniformity of the target.
Excellent electrical properties: Reliable atmosphere sintering enables stable electrical conductivity of oxides with semiconductor characteristics.

* Maximum sizes of planar target    

   Thickness: 30mm (can be 60mm for round target)    

   Width: max 2000mm    

   Length: max 4000mm    

* Maximum sizes of rotary target    

   Vacuum/Air Spraying    

        Backing tubes: ID56 x OD64 x Length300~3000mm, Thickness: 3~5mm    

        Backing tubes: ID78~83 x OD89~92 x Length300~3000mm, Thickness: 3~7mm    

        Backing tubes: ID100 x OD108 x Length300~3000mm, Thickness: 3~8mm    

        Backing tubes: ID125 x OD133 x Length300~4000mm, Thickness: 3~13mm    

   Bonding    

        Backing tubes: ID125 x OD133 x Length500~4000mm, Thickness: 8~13mm    

* Planar/Rotary target can be customised as per your request.

Sputtering coating refers to the technology that the ions produced by the ion source are accelerated to gather in the vacuum to form a high speed ion beam, which bombards the solid surface, and the kinetic energy exchange between the ions and the solid surface atoms makes the atoms on the solid surface leave the solid and deposit on the surface of the substrate material. The bombarded solid is the raw material for deposition of thin film materials by sputtering method, which is called the sputtering target .If you need any information or a quote please contact us , you can contact our sales team directly or fill out the form below and we will get back to you in time.